Nitride Semiconductor Structure and Method of Making Same

ABSTRACT

A structure method for producing same provides suppressed lattice defects when epitaxially forming nitride layers over non-c-plane oriented layers, such as a semi-polar oriented template layer or substrate. A patterned mask with “window” openings, or trenches formed in the substrate with appropriate vertical dimensions, such as the product of the window width times the cotangent of the angle between the surface normal and the c-axis direction, provides significant blocking of all diagonally running defects during growth. In addition, inclined posts of appropriate height and spacing provide a blocking barrier to vertically running defects is created. When used in conjunction with the aforementioned aspects of mask windows or trenches, the post structure provides significant blocking of both vertically and diagonally running defects during growth.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH AND DEVELOPMENT

The U.S. Government has a fully paid-up license in this disclosure andthe right in limited circumstances to require the patent owner tolicense others on reasonable terms as provided for by the terms ofcontract number W911 NF-08-C-0003 awarded by DARPA-VIGIL.

BACKGROUND

The present disclosure is related to reducing defects which form duringgrowth of semiconductor materials over a substrate, and morespecifically to reducing certain dislocations which arise due to thelattice mismatch between a substrate and a nitride material grownthereover.

It is quite well known that when epitaxially growing a material such asa semiconductor over a substrate, a mismatch in the lattice constants ofthe substrate and the growth material can result in crystalline defectsin the material as grown. This is illustrated in FIG. 7 for a structure100. Substrate 102 is typically oriented such that its crystalboundaries 104 are oriented roughly perpendicular to the plane of thegrowth surface (i.e., vertically). As a growth material 106, such asgallium nitride (GaN), forms over substrate 102, lattice defects 108form therein which are roughly parallel to the crystal boundaries 104 ofsubstrate 102. There are various techniques known in the art forsuppressing these defects.

One material system of particular interest today is the nitride system(e.g. compounds formed between any group-III element and nitrogen).Nitride-based materials are able to produce light-emitting devices suchas diode lasers and the like which emit light at shorter wavelengthscorresponding to green, blue, and even ultra violet (UV) light ascompared to other known material systems. Other applications for thenitrides are transistors and other electronic devices. However, nitridematerials are typically grown by metalorganic chemical vapor (MOCVD)deposition techniques onto lattice-mismatched substrates like forexample sapphire, silicon carbide, and silicon for which there arerelatively fewer options to address and prevent lattice mismatchdefects.

One known technique for suppressing lattice dislocations in MOCVDprocesses is known as lateral overgrowth, which is illustrated in FIG.8. Again, a c-plane oriented substrate 102 such as Al₂O₃ (sapphire), isthe typical starting point. In order to suppress the verticaldislocation defects, a mask layer 112 is formed over the surface ofsubstrate 102, and one or more openings 114 are then formed in the mask.GaN layer 116 is then epitaxially grown over substrate 102, beginning inopenings 114 in order to initiate the epitaxy. The GaN grows bothvertically and laterally. Due to the crystallographic orientation ofsubstrate 102, any vertical defects forming in layer 116 are limited tothe opening areas, and are either suppressed or bent horizontally overthe mask 112. Thus the regions over the mask 112 are substantially freeof vertical lattice dislocations.

While c-plane oriented substrates have been the most widely usedsubstrates to date, other orientations such as semi-polar and m-planeorientations are becoming increasingly important. For example, bulksemi-polar GaN substrates are highly desired for (InGaAl)N-based lightemitters such as light-emitting diodes (LEDs) and laser diodes (LDs), inorder to reduce internal electric fields which impair the efficiency ofthe light emission process on conventional c-axis oriented nitridedevices. However, such bulk substrates are not yet widely available andare limited to small sizes. As an alternative to bulk semi-polar GaNsubstrates, semi-polar GaN templates have been grown on large areasapphire substrates by conventional means such as Hydride Vapor PhaseEpitaxy (HVPE). However, the defect density in such template layers isof the order of 10¹⁰ cm⁻², unless defect reduction techniques areapplied.

While lateral overgrowth is an effective technique for c-plane orientedsubstrates, it is not optimized for materials in which the c-axis istilted with respect to the surface normal, such as any semi-polaroriented GaN, in which a significant portion of defects extend acrossthe GaN layer at an angle corresponding to the tilt of the basal planeGaN(0001). With reference next to FIG. 9, one difficulty observed isthat since the lattice defects 128 in semi-polar template layer 122 (orequivalently, a semi-polar substrate, not shown) run diagonally, e.g.,at a given angle between 0 and 90 degrees relative to the plane ofgrowth surface 132 of layer 122, the effectiveness of the mask atlimiting communication of the defects into the growth layer 116 isreduced. FIGS. 10 a-10 f are TEM images of GaN(1122) layers grown by alateral overgrowth technique on a semi-polar buffer layer, as known inthe art. Cross-section images shown in FIGS. 10 e and 10 f highlight thepersistence of diagonally running defects despite the presence oflateral overgrowth mask 126. To compound this problem, certain substrateorientations present defects in multiple different planes (e.g.,perpendicular to the growth surface as well as angled relative to thatplane). To date, there have been inadequate solutions for suppressinglattice defects in epitaxial growth layers formed over non-c-planeoriented layers.

SUMMARY

Accordingly, the present disclosure is directed to a method andstructure for suppressing lattice defects in nitride-based epitaxialgrowth layers formed over non-c-plane oriented layers, such as asemi-polar oriented template layer or substrate. According to one aspectof the disclosure, a patterned mask with “window” openings formedtherein with vertical dimensions according to the product of the windowwidth times the cotangent of the angle between the surface normal andthe c-axis direction for the semi-polar layer provides significantblocking of all diagonally running defects during growth.

According to another aspect of the disclosure, etched trenches in thetemplate layer or substrate, with vertical dimensions according to theproduct of the trench opening width times the cotangent of the anglebetween the surface normal and the c-axis direction for the semi-polarlayer provides significant blocking of all diagonally running defectsduring growth.

According to another aspect of the disclosure, etched trenches in thetemplate layers or substrates are formed and selectively covered by adielectric mask leaving only the facet in GaN[0001] direction uncovered.

According to a still further aspect of the disclosure, inclined posts ofappropriate height and spacing provide a blocking barrier to verticallyrunning defects is created. When used in conjunction with theaforementioned aspects of mask windows or trenches, significant blockingof both vertically and diagonally running defects during growth isprovided.

The above is a summary of a number of the unique aspects, features, andadvantages of the present disclosure. However, this summary is notexhaustive. Thus, these and other aspects, features, and advantages ofthe present disclosure will become more apparent from the followingdetailed description and the appended drawings, when considered in lightof the claims provided herein.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings appended hereto like reference numerals denote likeelements between the various drawings. While illustrative, the drawingsare not drawn to scale. In the drawings:

FIG. 1 is a structure with lattice defect suppressing islands formedthereon according to one embodiment of the present disclosure.

FIG. 2 is a close-up illustration of a portion of the structure of FIG.1, showing added details of the lattice defect suppressing islandsaccording to one embodiment of the present disclosure.

FIG. 3 is a structure with lattice defect suppressing trenches formedtherein according to one embodiment of the present disclosure.

FIG. 4 is a close-up illustration of a portion of the structure of FIG.3, showing added details of the lattice defect suppressing trenchesaccording to one embodiment of the present disclosure.

FIGS. 5A and 5B are illustrations of a structure with selectively-maskedlattice defect-suppressing trenches formed therein according to oneembodiment of the present disclosure.

FIG. 6 is a structure with lattice defect suppressing islands andinclined posts formed thereon according to a another embodiment of thepresent disclosure.

FIG. 7 is an illustration of a prior art structure showing the formationof vertical lattice defects in a growth medium formed over a crystallinesubstrate.

FIG. 8 is an illustration of the lateral overgrowth process according tothe prior art.

FIG. 9 is an illustration of a structure exhibiting both vertical andinclined lattice defects despite employing lateral overgrowth accordingto the prior art.

FIGS. 10 a through 10 f are TEM images of GaN layers grown by a lateralovergrowth technique on a semi-polar buffer layer, as known in the art.

DETAILED DESCRIPTION

We initially point out that descriptions of well known startingmaterials, processing techniques, components, equipment and other wellknown details are omitted so as not to unnecessarily obscure the detailsof the present invention. Thus, where details are otherwise well known,we leave it to the application of the present invention to suggest ordictate choices relating to those details.

As a solution to the problems of defect suppression when growingmaterial over a non-c-plane oriented layer or substrate, the presentdisclosure describes a number of techniques for preparation of thegrowth surface according to the specific characteristics of the surfaceorientation. The present disclosure makes use of the fact that the tiltangle at which defects may form in the growth material is defined inpart by the particular surface orientation of the layer or substrate onwhich the growth material is formed.

According to a first embodiment of the present disclosure, a growthmaterial layer is formed over a template layer. A mask is formed overthe template layer, and regular “windows” are formed therein. Thethickness of the masking material is selected to be greater than orequal to the product of the window width times the tangent of the anglebetween the surface normal and the primary plane of the templatematerial. As the growth proceeds in the window areas, all defects tiltedaccording to the tilt of the basal plane will be blocked by the mask.

With reference to FIG. 1, a specific example of this first embodiment isnext described. A structure 10 according to this embodiment comprises atemplate substrate 12, which may be a 1 micron thick or thicker nitridelayer (e.g., GaN, AlGaN, or InGaN or combinations thereof) of semi-polarorientation (e.g., other than (0001) or (1010) oriented surface) grownby MOCVD (or any suitable method) on sapphire or any other suitablesubstrate (not shown). While a gallium nitride (GaN) growth materiallayer formed over a GaN template layer over a Al₂0₃ (sapphire) substrateis described in this example, other growth and substrate materials maybe employed (as well as other layers of structure 10), and theparticular materials of this example are selected merely for explanationpurposes. In the case of wurtzitic nitride substrates, substrate 12 hasa growth plane corresponding to a crystallographic plane forming anangle α other than 0 or 90 degrees to its primary crystallographicplane. For other crystallographic substrate materials, substrate 12 isoriented such that its primary crystallographic plane is at an angle αthat is out of normal to said growth plane.

A dielectric layer 14, for example SiO₂ 2 microns thick, is deposited ontemplate substrate 12. Next, a photoresist layer 16 is deposited, and isshown in dashed outline to represent that it is subsequently removedfrom the final structure. Photoresist layer 16 is patterned byconventional photolithography to form a regular pattern of stripesspaced apart by a distance, for example, in the range of 1 to 20 micronsor a geometrical pattern of openings, for example 1 micrometer by 1micrometer squares, spaced apart by a distance in a range of 1 to 20microns (or alternatively, hexagonal or other shaped openings), althoughother spacings are contemplated and depend on the application of theteachings of the present disclosure.

The SiO₂ layer 14 is then mask-patterned using the mask of photoresist16, for example by chemical assisted ion-beam etching (CAIBE) therebydefining islands 18 and windows 20. Islands 18 define sidewalls 22predominantly in the direction of the c-axis (i.e., perpendicular to agrowth surface 24) of the GaN unit cell and parallel to the direction ofthe basal plane of the GaN unit cell.

Prior to transfer into the growth chamber, selective surface cleaning isperformed to remove the photoresist layer 16 while not attacking theSiO₂ layer 14. Following transfer to the MOCVD growth chamber, thesubstrate is heated to 1050° C. in an ammonia atmosphere and a layergrowth (GaN, AlGaN) starts at a rate of 0.5-4 micron/hr. Layer growthproceeds both vertically and laterally, and proceeds until fullcoalescence is achieved (i.e., material grows uniformly both aboveislands 18 and windows 20), thereby forming layer 26. Thereafter, devicestructures (not shown) consisting of a plurality of doped or undopedGaN, InGaN, AlGaN, etc. layers may be deposited.

As will be appreciated from FIG. 1, the crystallographic axis of growthsubstrate 12 is inclined relative to growth plane 24. The thickness oflayer 14, and hence the height of islands 18, is precisely chosen sothat it is at least sufficiently tall that any dislocation defects 28communicated from substrate 12 into growth layer 26 and continuingtherein as defects 30 terminate at sidewall 22 (yet minimally thick forrapid surface smoothness upon coalescence of the growth island, and forease of patterning). With reference to FIG. 2, this is calculated suchthat the height, h, of island 18 is greater than or equal to the productof the window width, w, times the cotangent of the angle α between thesurface normal, N, and the primary plane, or

h=w cot α

In a second embodiment, the growth surface is patterned by a mask andgrooves are etched into the surface with a depth greater than or equalto the product of the width of the grooves times the tangent of theangle between the surface normal and the GaN[0001] direction. This takesadvantage of a large difference of growth rates along the GaN[0001] andalong the opposite GaN[000-1] direction. As the former is higher andleads to defect reduction, the grooves are filled with defect-reducedmaterial and tilted defects do not propagate to the surface.

With reference to FIG. 3, there is shown therein a structure 40according to this second embodiment of this disclosure. Structure 40comprises a template substrate 42, which may be a 2 micron thick orthicker nitride layer (e.g., GaN, AlGaN, or InGaN or combinationsthereof) of semi-polar orientation (e.g., other than (0001) or (1010)oriented surface) grown by MOCVD (or any other suitable method) onsapphire or any other suitable substrate (not shown). A dielectric layer44, for example SiO₂, of 0.2 micron thickness is deposited on templatesubstrate 42.

Next, a photoresist layer 46 is deposited, and is shown in dashedoutline to represent that it is subsequently removed from the finalstructure. Photoresist layer 46 is patterned by conventionalphotolithography to form a regular geometrical pattern of openings, forexample 1 micrometer by 1 micrometer square (or alternatively, hexagonalor other shaped openings, or stripes). The spacing of these regularpatterns may, for example, be in a range of 1 to 20 micron, althoughother spacings are contemplated and depend on the application of theteachings of the present disclosure.

The SiO₂ layer 44 as well as substrate 42 are then mask-patterned, forexample by chemical assisted ion-beam etching (CAIBE) using layer 46 asa mask, thereby defining channels 48. Channels 48 extend into substrate42 and have a height h measured from the surface 52 of SiO₂ layer 44, asdescribed further below. Channels 48 define sidewalls 50 predominantlyin the direction of the c-axis (i.e., perpendicular to growth surface51) of the GaN unit cell and parallel to the basal plane of the GaN unitcell.

Prior to transfer into the growth chamber, selective surface cleaning isperformed to remove the photoresist layer 46 while not attacking theSiO₂ layer 44. Following transfer to the MOCVD growth chamber, thesubstrate is heated to 1050° C. in an ammonia atmosphere and a layergrowth (GaN, AlGaN) starts at a rate of 0.5-4 micron/hr. Layer growthproceeds both vertically and laterally, and proceeds until fullcoalescence is achieved and layer 54 is formed. Thereafter, devicestructures (not shown) consisting of a plurality of doped or undopedGaN, InGaN, AlGaN, etc. layers may be deposited.

As will be appreciated from FIG. 3, the crystallographic axis of growthsubstrate 42 is inclined relative to the plane of growth surface 51. Thedepth of channels 48 are precisely chosen so that they are at leastsufficiently deep that any dislocation defects 56 communicated fromsubstrate 42 into growth layer 54 forming new defects 58 terminate atsidewall 50. With reference to FIG. 4, this is calculated such that theheight, h, of channel 48 is greater than or equal to the product of thechannel width, w, times the cotangent of the angle α between the surfacenormal, N, and the primary plane, or

h=w cot α

In a third embodiment, the growth surface is mask-patterned and groovesare etched into the surface with a depth greater than at least 0.1-0.5μm. After etching, a masking layer is selectively deposited on allgrowth surfaces except for the specific facet of the grooves that pointsin GaN[0001] direction. This blocks any growth other than along theGaN[0001] from the highly defective seed template or substrate. Thereby,the grooves are filled with defect-reduced material and tilted defectsdo not propagate to the surface.

With reference to FIG. 5A, there is shown therein a structure 200according to this third embodiment of this disclosure. Structure 200comprises a template substrate 202, which may be a 2 micron thick orthicker nitride layer (e.g., GaN, AlGaN, or InGaN or combinationsthereof) of semi-polar orientation (e.g., other than (0001) or (1010)oriented surface) grown by MOCVD (or any other suitable method) onsapphire or any other suitable substrate (not shown). A photoresistlayer (not shown) is deposited and patterned by conventionalphotolithography to form a regular geometrical pattern of openings, forexample 1 micrometer by 1 micrometer square (or alternatively, hexagonalor other shaped openings, or stripes). The spacing of these regularpatterns may, for example, be in a range of 1 to 20 micron, althoughother spacings are contemplated and depend on the application of theteachings of the present disclosure.

The substrate 202 is then mask-patterned, for example by chemicalassisted ion-beam etching (CAIBE), thereby defining channels 204.Channels 204 extend into substrate 202 and have a height h measured fromthe surface 206 of substrate 202, as described further below. Channels204 define sidewalls 208 predominantly in the direction of the c-axis(i.e., perpendicular to growth surface 206) of the GaN unit cell andparallel to the basal plane of the GaN unit cell.

With reference to FIG. 5B, surface cleaning is performed to remove thephotoresist layer. Then, the sample is loaded into an evaporationchamber in such a way that the facet pointing in the GaN[0001] directionis the only facet shaded against the evaporation source. This can beobtained by tilting the surface normal in GaN[0001] direction by about5-10 degree. A 100 nm SiO₂ layer 210 is then deposited using electronbeam evaporation, for example. This results in the deposition of layer210 over surface 20, and the bottom 204 a and a first side 204 b ofchannel 204, but does not result in the deposition of layer 210 on asecond side 204 c of channel 204.

Returning to FIG. 5A, the substrate is transferred to an MOCVD growthchamber, and heated to 1050° C. in an ammonia atmosphere and a layergrowth (GaN, AlGaN) starts at a rate of 0.5-4 micron/hr. Layer growthproceeds both vertically and laterally, and proceeds until fullcoalescence is achieved and layer 212 is formed. Thereafter, devicestructures (not shown) consisting of a plurality of doped or undopedGaN, InGaN, AlGaN, etc. layers may be deposited.

As will be appreciated from FIGS. 5A and 5B, the crystallographic axisof growth substrate 202 is inclined relative to the plane of growthsurface 212. All facets are SiO₂-covered except for the facet pointingin the GaN[0001] direction.

According to a fourth embodiment 60 shown in FIG. 6, either one or bothof the techniques described above are employed together with additionalprocesses in order to produce a structure capable of suppressingdislocation defects both in the c-plane (i.e., perpendicular to theplane of growth) as well as inclined thereto. This embodimentaccommodates substrates with complex crystallographies and a variety ofconditions leading to the formation of defects in materials grownthereover.

Accordingly, embodiment 60 includes a plurality of posts 62 inclined atan angle β out of the surface normal, which are formed by reducing thegrowth rate along the GaN[0001]-direction while increasing the growthrate in the perpendicular GaN[1010] direction (or vice versa). Therelative growth rates depend on the composition of the nitridesemiconductor layer and can be controlled by growth parameters such astemperature, pressure, and V/III ratio. Depending on the width of themask opening, the GaN[0001] facet (or the GaN[1010] of post 62 willintersect with all vertically running defects 64 upon reaching a certaincritical post height, h_(c), and thereby terminate those defects.Coalescence of the posts can be forced above the critical height bychanging the growth parameters in such a way that favors new growthalong the GaN[0001] direction.

With reference to FIG. 6, structure 60 comprises a template substrate66, which may be a 2 micron thick or thicker nitride layer (e.g., GaN,AlGaN, or InGaN or combinations thereof) of semi-polar orientation(e.g., other than (0001) or (1010) oriented surface) grown by MOCVD (orany other suitable method) on sapphire or any other suitable substrate(not shown). A dielectric layer 68, for example SiO₂ 2 microns thick, isdeposited on template substrate 66.

Next, a photoresist layer 70 is deposited, and is shown in dashedoutline to represent that it is subsequently removed from the finalstructure. Photoresist layer 70 is patterned by conventionalphotolithography to form a regular pattern of openings, for example1-micrometer wide stripes. The pitch of these stripes may be in a rangeof 10 to 20 micron, although other spacings are contemplated and dependon the application of the teachings of the present disclosure. A largerpitch (i.e., stripe separation) is beneficial for delaying thecoalescence process, as discussed further below. The mask definessidewalls predominantly in direction of the c-axis of the GaN unit cell.

For purposes of illustration, this embodiment 60 is described employingthe first “island” embodiment described above, although the second“trench” embodiment described above is equally useful herein. The SiO₂layer 68 is then mask-patterned, for example by chemical assistedion-beam etching (CAIBE) thereby defining islands 72 and windows 74.Islands 72 define sidewalls 76 predominantly in the direction of thec-axis (i.e., perpendicular to a growth surface 78) of the GaN unit celland parallel to the basal plane of the GaN unit cell.

Prior to transfer into the growth chamber, selective surface cleaning isperformed to remove the photoresist layer 70 while not attacking theSiO₂. The growth chamber is a vertical quartz tube with a rotatingtwo-inch SiC-coated graphite susceptor. The susceptor body is heated byinductive heating which is controlled via pyrometric temperature readingfrom the backside of the susceptor. Following transfer to the MOCVDgrowth chamber, the substrate is heated to 1050° C. in an ammoniaatmosphere and a layer growth (GaN, AlGaN) starts at a rate of 2micron/h (for growth on a planar substrate) and a reactor pressure of200 Torr using input flow rates of 6.7 μmol/min trimethylgallium, 4 slpmammonia, and 6 slpm hydrogen. Growth proceeds in the GaN[0001] directionat a rate of about 1 μm/h, and greater than 5 μm/h in the GaN[1010]direction. Thereby, pre-dominant growth occurs in the GaN[1010]direction, yielding posts with side facets inclined by 58 degrees withrespect to the surface. The GaN layer growth may proceed until fullcoalescence of layer 80 is achieved, much as described above.

Alternatively, after reaching a thickness where the sidewalls of the GaNposts are completely intercepting the surface normal over the maskopenings the growth conditions may be changed to favor fastercoalescence. For example, an AlGaN layer may be grown on top of the GaNpost ends such that layer 80 is comprised of AlGaN. Afterwards, devicestructures consisting of a plurality of doped or undoped GaN, InGaN,AlGaN layers may be deposited.

The physics of modern electrical devices and the methods of theirproduction are not absolutes, but rather statistical efforts to producea desired device and/or result. Even with the utmost of attention beingpaid to repeatability of processes, the cleanliness of manufacturingfacilities, the purity of starting and processing materials, and soforth, variations and imperfections result. Accordingly, no limitationin the description of the present disclosure or its claims can or shouldbe read as absolute. The limitations of the claims are intended todefine the boundaries of the present disclosure, up to and includingthose limitations. To further highlight this, the term “substantially”may occasionally be used herein in association with a claim limitation(although consideration for variations and imperfections is notrestricted to only those limitations used with that term). While asdifficult to precisely define as the limitations of the presentdisclosure themselves, we intend that this term be interpreted as “to alarge extent”, “as nearly as practicable”, “within technicallimitations”, and the like.

Furthermore, while a plurality of preferred exemplary embodiments havebeen presented in the foregoing detailed description, it should beunderstood that a vast number of variations exist, and these preferredexemplary embodiments are merely representative examples, and are notintended to limit the scope, applicability or configuration of thedisclosure in any way. Various of the above-disclosed and other featuresand functions, or alternative thereof, may be desirably combined intomany other different systems or applications. Various presentlyunforeseen or unanticipated alternatives, modifications variations, orimprovements therein or thereon may be subsequently made by thoseskilled in the art, which are also intended to be encompassed by theclaims, below.

Therefore, the foregoing description provides those of ordinary skill inthe art with a convenient guide for implementation of the disclosure,and contemplates that various changes in the functions and arrangementsof the described embodiments may be made without departing from thespirit and scope of the disclosure defined by the claims thereto.

1. A semiconductor structure, comprising: a wurtzitic nitride substratehaving a growth surface defining a growth plane, said growth planecorresponding to a crystallographic plane forming an angle α other than0 or 90 degrees to the primary crystallographic plane of the substrate;a nitride-based growth medium disposed over said substrate; andstructural sidewalls extending substantially normal to said growth planeand defining a plurality of window openings, said window openings havinga width, w, and a height, h, said window openings further having formedtherein a portion of said nitride-based growth medium such thatcrystallographic defects which originate at a portion of said growthsurface and have an angular orientation substantially parallel to theorientation of said crystallographic plane of said substratesubstantially terminate at said sidewalls and thereby substantially donot extend beyond the height of said window openings.
 2. Thesemiconductor structure of claim 1, further comprising a dielectriclayer formed over said growth surface of said substrate, said dielectriclayer patterned to form islands, and wherein said structural sidewallsare sidewalls of said islands.
 3. The semiconductor structure of claim1, wherein said substrate is patterned to have trenches formed therein,and wherein said sidewalls are sidewalls of said trenches.
 4. Thesemiconductor structure of claim 1, further comprising a dielectriclayer formed over and in contact with said growth surface, and furtherwherein said height, h, is the distance between an upper surface of saiddielectric layer and said growth surface, and is at least equal to theproduct of the width, w, and the cotangent of the angle α.
 5. Thesemiconductor structure of claim 4, wherein said dielectric layercomprises silicon nitride (SiN_(x)), said nitride-based growth mediumcomprises gallium nitride (GaN), and said substrate comprises semi-polarGaN(1122).
 6. The semiconductor structure of claim 1, wherein saidsubstrate comprises semi-polar GaN(1122).
 7. The semiconductor structureof claim 1, further comprising nitride-based growth medium formed overand in physical contact with said nitride-based growth medium formed ina plurality of said window openings.
 8. The semiconductor structure ofclaim 1, further comprising post structures said post structures: formedof said nitride-based growth medium; formed over said nitride-basedgrowth medium formed in said window openings to a height h over saidgrowth surface; formed to have sidewall facets; and formed to beinclined at an angle, β, relative to said growth plane and out of normalto said growth plane; whereby, crystallographic defects which originateat a portion of said growth surface and have an orientationsubstantially normal to said crystallographic plane substantiallyterminate at said facets and thereby substantially do not extend beyondthe height h of said post structures.
 9. The semiconductor structure ofclaim 8, further comprising nitride-based growth medium formed over andin physical contact with a plurality of said post structures.
 10. Thesemiconductor structure of claim 4, wherein said dielectric layercomprises silicon nitride (SiN_(x)), said nitride-based growth mediumcomprises gallium nitride (GaN), and said substrate comprises semi-polarGaN(1122).
 11. A method of forming a semiconductor structure over asubstrate such that reduced crystallographic defects are obtained,comprising: orienting said substrate to have a growth surface defining agrowth plane, said substrate oriented such that its primarycrystallographic plane is oriented at an angle α which is out of normalto said growth plane; forming structural sidewalls over at least aportion of said growth surface and extending substantially normal tosaid growth plane and defining a plurality of window openings, saidwindow openings having a width, w, and a height, h; forming anitride-based structure over said substrate such that said windowopenings have formed therein a portion of said nitride-based growthmedium such that crystallographic defects which originate at a portionof said growth surface and have an angular orientation substantiallyparallel to the orientation of said crystallographic plane of saidsubstrate substantially terminate at said sidewalls and therebysubstantially do not extend beyond the height of said window openings.12. The method of claim 11, further comprising: forming a dielectriclayer over said growth surface of said substrate; and patterning saiddielectric layer to form islands; wherein said structural sidewalls aresidewalls of said islands.
 13. The method of claim 11, furthercomprising: patterning said substrate so as to have trenches formedtherein; wherein said sidewalls are sidewalls of said trenches.
 14. Themethod of claim 11, further comprising: forming a dielectric layer overand in contact with said growth surface; wherein said height, h, is thedistance between an upper surface of said dielectric layer and saidgrowth surface, and is at least equal to the product of the width, w,and the cotangent of the angle α.
 15. The method of claim 11, furthercomprising forming nitride-based growth medium over and in physicalcontact with said nitride-based growth medium formed in a plurality ofsaid window openings.
 16. The method of claim 11, further comprising:forming post structures of said nitride-based growth medium over saidnitride-based growth medium formed in said window openings, said poststructures formed: to a height h over said growth surface; to havesidewall facets; and to be inclined at an angle, β, relative to saidgrowth plane and out of normal to said growth plane; whereby,crystallographic defects which originate at a portion of said growthsurface and have an orientation substantially normal to saidcrystallographic plane substantially terminate at said facets andthereby substantially do not extend beyond the height h of said poststructures.
 17. The method of claim 16, further comprising forming anitride-based growth medium over and in physical contact with aplurality of said post structures.